The ANSYS Campus Solutions bundle provides access to the majority of offered ANSYS software, including HFSS, Maxwell, SpaceClaim 3D Modeller, IcePak and Fluent/CFX. It provides simulation capabilities for structures, heat transfer, fluid dynamics, explicit dynamics, electromagnetics and multiphysics solvers, ANSYS Workbench, CAD import tools, solid modeling, 3-D full wave electromagnetic fields (frequency and time domain), power and signal integrity, 2/3-D parasitic extraction tools & solvers; high performance shared & distributed memory (HPC) solvers, advanced meshing, and post-processing features. For more information on what is included in this bundle, please refer to the ANSYS Academic Features Product Table at.

Simulate larger designs with more parameters in far less time. HPC enhances your engineering productivity by accelerating your simulation throughput. Building on a sustained investment in HPC software innovation and development, ANSYS solutions are engineered for scalability, so you can apply simulation at the appropriate level of detail. Amd motherboard manual.